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IT Process & Automation Analyst

Location: Horsham, PA, USA
Compensation:

USD 75k-85k / year

Posted:
Today
Associate
Angel Investment
Business And Industrial
Finance
Financial Services
Fund
Incubators
Lending and Investments
Private Equity
Venture Capital
Venture Capital and Private Equity Principals

IT Process & Automation Analyst

Location: Horsham, PA, USA; Horsham, UK
Compensation:

USD 75k-85k / year

Posted:
4 days
Associate
Administrative Services
Analytics
Artificial Intelligence
Business/Productivity Software
Career Planning
Data & Analytics
Data Management
Employee Development
Enterprise Software
Fitness and Wellness
Hiring
Human Capital Services
Human Resources
Human Resources Hr
Human Resources Services
Platform
Professional Services
Psychometric Assessments
Recruiting
SaaS
Science and Engineering
Software
Succession Planning
Talent Acquisition
Talent Management
Technology
Technology And Computing
Workforce Planning

Sr. Photonics Process Simulation Engineer - Santa Clara, CA

Location: United States
Compensation:

USD 150k-200k / year + Equity

Posted:
Today
Senior
Angel Investment
Business And Industrial
Finance
Financial Services
Fund
Incubators
Lending and Investments
Private Equity
Venture Capital
Venture Capital and Private Equity Principals

Sr. Process Integration Engineer - Santa Clara, CA

Location: United States
Compensation:

USD 150k-200k / year + Equity

Posted:
Today
Senior
Angel Investment
Business And Industrial
Finance
Financial Services
Fund
Incubators
Lending and Investments
Private Equity
Venture Capital
Venture Capital and Private Equity Principals

Photonics Fabrication Process Engineer- SNSPD Nanofabrication - Santa Clara, CA

Location: United States
Compensation:

USD 130k-180k / year + Equity

Posted:
Today
Mid-Senior Level
Angel Investment
Business And Industrial
Finance
Financial Services
Fund
Incubators
Lending and Investments
Private Equity
Venture Capital
Venture Capital and Private Equity Principals

Process Integration Engineer - Heterogeneous Integration Development - Santa Clara, CA

Location: United States
Compensation:

USD 130k-180k / year + Equity

Posted:
Today
Mid-Senior Level
Angel Investment
Business And Industrial
Finance
Financial Services
Fund
Incubators
Lending and Investments
Private Equity
Venture Capital
Venture Capital and Private Equity Principals

Packaging Engineer - Die Bonding Process

Location: Toronto, ON, Canada
Compensation:

CAD 110k-140k / year + Equity

Posted:
Today
Associate
Angel Investment
Business And Industrial
Finance
Financial Services
Fund
Incubators
Lending and Investments
Private Equity
Venture Capital
Venture Capital and Private Equity Principals

Photonics Fabrication Process Engineer- SNSPD Nanofabrication - Santa Clara, CA

Location: United States
Compensation:

USD 130k-180k / year + Equity

Posted:
4 days
Mid-Senior Level
Angel Investment
Business And Industrial
Finance
Financial Services
Fund
Incubators
Lending and Investments
Private Equity
Venture Capital
Venture Capital and Private Equity Principals

Sr. Photonics Process Simulation Engineer - Santa Clara, CA

Location: United States
Compensation:

USD 150k-200k / year + Equity

Posted:
4 days
Senior
Angel Investment
Business And Industrial
Finance
Financial Services
Fund
Incubators
Lending and Investments
Private Equity
Venture Capital
Venture Capital and Private Equity Principals

Sr. Process Integration Engineer - Santa Clara, CA

Location: United States
Compensation:

USD 150k-200k / year + Equity

Posted:
4 days
Senior
Angel Investment
Business And Industrial
Finance
Financial Services
Fund
Incubators
Lending and Investments
Private Equity
Venture Capital
Venture Capital and Private Equity Principals

Process Integration Engineer - Heterogeneous Integration Development - Santa Clara, CA

Location: United States
Compensation:

USD 130k-180k / year + Equity

Posted:
4 days
Mid-Senior Level
Angel Investment
Business And Industrial
Finance
Financial Services
Fund
Incubators
Lending and Investments
Private Equity
Venture Capital
Venture Capital and Private Equity Principals

Process Integration Engineer - Heterogeneous Integration Development - Santa Clara, CA

Location: United States
Compensation:

USD 130k-180k / year + Equity

Posted:
23 days
IPO
Mid-Senior Level
Advice
Artificial Intelligence
Asset Management
Big Data
Business/Productivity Software
Cloud Computing
Cloud services(SaaS)
Computer Hardware Manufacturing
Data & Analytics
Deep Learning
Enterprise Software
Financial Services
Hardware
Machine Learning
Media & Entertainment
Open Source
Other Hardware
Platform
Professional Services
Quantum Computing
Science and Engineering
Software
Technology
Technology And Computing

Sr. Photonics Process Simulation Engineer - Santa Clara, CA

Location: United States
Compensation:

USD 150k-200k / year + Equity

Posted:
23 days
IPO
Senior
Advice
Artificial Intelligence
Asset Management
Big Data
Business/Productivity Software
Cloud Computing
Cloud services(SaaS)
Computer Hardware Manufacturing
Data & Analytics
Deep Learning
Enterprise Software
Financial Services
Hardware
Machine Learning
Media & Entertainment
Open Source
Other Hardware
Platform
Professional Services
Quantum Computing
Science and Engineering
Software
Technology
Technology And Computing

Sr. Process Integration Engineer - Santa Clara, CA

Location: United States
Compensation:

USD 150k-200k / year + Equity

Posted:
23 days
IPO
Senior
Advice
Artificial Intelligence
Asset Management
Big Data
Business/Productivity Software
Cloud Computing
Cloud services(SaaS)
Computer Hardware Manufacturing
Data & Analytics
Deep Learning
Enterprise Software
Financial Services
Hardware
Machine Learning
Media & Entertainment
Open Source
Other Hardware
Platform
Professional Services
Quantum Computing
Science and Engineering
Software
Technology
Technology And Computing

Photonics Fabrication Process Engineer- SNSPD Nanofabrication - Santa Clara, CA

Location: United States
Compensation:

USD 130k-180k / year + Equity

Posted:
23 days
IPO
Mid-Senior Level
Advice
Artificial Intelligence
Asset Management
Big Data
Business/Productivity Software
Cloud Computing
Cloud services(SaaS)
Computer Hardware Manufacturing
Data & Analytics
Deep Learning
Enterprise Software
Financial Services
Hardware
Machine Learning
Media & Entertainment
Open Source
Other Hardware
Platform
Professional Services
Quantum Computing
Science and Engineering
Software
Technology
Technology And Computing

Packaging Engineer - Die Bonding Process

Location: Toronto, ON, Canada
Compensation:

CAD 110k-140k / year + Equity

Posted:
2 months
IPO
Mid-Senior Level
Advice
Artificial Intelligence
Asset Management
Big Data
Business/Productivity Software
Cloud Computing
Cloud services(SaaS)
Computer Hardware Manufacturing
Data & Analytics
Deep Learning
Enterprise Software
Financial Services
Hardware
Machine Learning
Media & Entertainment
Open Source
Other Hardware
Platform
Professional Services
Quantum Computing
Science and Engineering
Software
Technology
Technology And Computing